For a world-leading advanced IC design center

Design of a complete 1 to 2 GHz PLL and serializer on Silterra130nm process

• Top level sizing and design specification
• Design of PFD, CP, loop filter, VCO, programmable dividers, prescalers, bias, bandgaps, temperature compensator;

Deliverables:

• Design, layout and back-annotation;
• Simulation reports;
• Regular reviews and interaction with the Customer;
• Support for integration

For a world-leading research center in nanoelectronics

Customization of our LVDS transmitter cell to customer specifications on Silterra130nm process;

• Design transfer (including layout) of the existing LVDS cell in TSMC 40nm;
• Re-design to accommodate to new specifications;
• Extensive jitter simulations, including the effect of packages parasitics;

Deliverables:

• Design, layout and back-annotation;
• Simulation reports;
• Regular reviews and interaction with the Customer;
• Support for integration

For a technology and chipset solutions provider in high performance imaging.

On TowerJazz 180nm process;

• Pre-study;
• Design and critical layout;
• PEX for parasitic effects, including package;
• Regular reporting to the Customer via Webex;
• Final go to silicon.

For a manufacturer of integrated systems and sensors for nuclear power plant applications.

On XFAB 0.35µm process (XH035)

• Consultancy and advisory on Radiation Hardening projects
• Participation in various technical meetings (EU)
• 1 senior designer

For a world-leading advanced IC design center.

On TSMC 0.25µm and TSMC 0.18µm processes

• Design, layout of various blocs for medical applications
• Long term partnership
• Two seniors designers
• Top level integration and verification
• Tape-out

For a leading company in high temperature semiconductor solutions, delivering standard products and custom solutions for extreme temperature and harsh environments.

Design, layout of various blocs for high temperature

• Long term partnership,
• Up to 3 highly skilled analog designers,
• XFAB XI10 SOI process,
• Interface with Customer specific tool chain

For the automotive division of a large semiconductors supplier company,

Long term partnership

• Large team of 6 designers or more,
• Feasibility, design, layout of various blocs:
• POR,
• High precision bandgap,
• Instrumentation op-amps,
• Measurement interfaces,
• Various communication protocols,
• I/Os, etc.
• Tape-outs and tests of chips

For a main leader company that designs and builds electrical systems for the aerospace, defence, transportation and security markets.

On XFAB 0.35um technology with HV option, two chip variants with

• Test structure for DAC and ADC
• Special low noise amplifiers
• Special tests on capacitors
• Test of a specific foundry-provided IP

A 29mm² die with more than 100 I/Os.

On XFAB 0.18um technology with HV option, a power management chip with

For a company providing high-performance micro-satellites for Earth observation applications.